Failure Modes and Mechanisms in Electronic Packages

Failure Modes and Mechanisms in Electronic Packages

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This text illustrates the fundamental causes of failures such as design, materials, and manufacturing processes, offers prevention methods through failure analysis, and provides design, material, and process improvements in electronics packaging. A detailed account of the failures of device packages, discrete components connectors, PCB carriers, and PCB assemblies are presented. Real life examples of failures commonly observed in the packaging industry as well as surveys of various failure models are also outlined in the book.The coplanarity of the surface finish is essential for paste printing accuracy and placement on fine featured SMT ... Chip on board (COB), which requires wire bonding, can also benefit with the use of palladium plating on PCB since it ... Electroless palladium is also mentioned as compatible with no clean fluxes used in assembly processes. ... All manufacturing equipment, fabrication processes and chemicals, test and inspection methods, and design rules are optimized around FR, 4.


Title:Failure Modes and Mechanisms in Electronic Packages
Author: Puligandla Viswanadham, P. Singh
Publisher:Springer Science & Business Media - 1998
ISBN-13:

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